NVIDIA HGX H200 Hopper Platform

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HGX H200 Hopper Platform
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EAN: 19379
Condition: new
Stock: available on order
Lead time: 25-35 days

The NVIDIA HGX H200 is a high-performance computing platform designed for AI training and inference, as well as high-performance computing (HPC) workloads. It features the NVIDIA H200 Tensor Core GPU, built on the Hopper architecture. This platform offers substantial improvements in computational power, memory bandwidth, and interconnect capabilities compared to its predecessors.

Equipment NVIDIA — These are highly productive data processing platforms, developed in accordance with modern requirements for computing systems in the fields of artificial intelligence, research, industrial automation and corporate analytics. Architecture used — Hopper, Grace Hopper, Blackwell — provide high calculation density, energy efficiency and scalability.

NVIDIA solutions are focused on comprehensive support for neural network training and inference tasks, including large language models, generative artificial intelligence, computer vision, natural language processing, modeling and virtualization of processes.

Key features of platforms:

  • Support for Hopper, Grace, Blackwell and other architectures Orin

  • The use of graphic processors with interfaces NVLink/NVSwitch for an accelerated interaction between GPU

  • Memory HBM3 or HBM3e with high bandwidth

  • Ability to build scaled clusters, combined into a single computing knot

  • Compatibility with NVIDIA AI Enterprise, CUDA, Triton Inference Server, TensorRT, RAPIDS and other libraries

Scope of equipment NVIDIA:

  • Training and Infession of Modeling and Artificial Intelligence Models

  • Modeling and simulating processes in scientific and engineering tasks

  • Automation of production processes and robotic complexes

  • Creating digital doubles of objects and technological chains

  • Treatment of large data arrays and highly loaded analytical calculations

  • Graphic rendering, 3D modeling, physical process simulation and visualization

A brief overview of the main lines of equipment:

  • HGX — Server platforms for data centers designed to build scalable artificial intelligence infrastructure. Used in rack solutions and dated centers.

  • DGX — Ready NVIDIA Systems for AI-Clea. These are pre -configured solutions with maximum productivity to teach large models. Applied in scientific centers, laboratories, corporate sector.

  • IGX Orin — Industrial-grade platform for embedded artificial intelligence systems. Used in medicine, automation, transport, safety systems.

  • GH200 / GB200 / GB300 — new generation superflies that combine CPU and GPU in a single computing module with coherent memory. Applied in AI cluster, cloud solutions, LLM-models and digital doubles.

  • RTX Workstation — Professional graphics processors for workstations. Designed for design and graphics professionals, 3D, CAD and visualization. Provide accelerated processing of professional applications and AI-tasks.

  • GeForce RTX for a note TbEven — mobile graphic processors designed for resource -intensive tasks: Games, Rendering, Modeling, Application AI at User level.

Advantages of use of equipment NVIDIA:

  • Maximum productivity for artificial intelligence and machine learning tasks

  • Infrastructure optimization to work with new generation models

  • High scalability — from one node to II cluster

  • Compatibility with leading frameworks and software

  • Support for corporate solutions and IT infrastructures

  • Perspective for building modern date centers and peripheral computing

Specifications NVIDIA HGX H200 Hopper Platform:

Feature 4-GPU Configuration 8-GPU Configuration
GPU Model NVIDIA H200 SXM NVIDIA H200 SXM
Tensor Core Performance    
FP64 34 TFLOPS 67 TFLOPS
FP64 Tensor Core 67 TFLOPS 134 TFLOPS
FP32 67 TFLOPS 134 TFLOPS
TF32 Tensor Core 989 TFLOPS 1,978 TFLOPS
BFLOAT16 Tensor Core 1,979 TFLOPS 3,958 TFLOPS
FP16 Tensor Core 1,979 TFLOPS 3,958 TFLOPS
FP8 Tensor Core 3,958 TFLOPS 7,916 TFLOPS
INT8 Tensor Core 3,958 TOPS 7,916 TOPS
GPU Memory 141 GB HBM3e 282 GB HBM3e
Memory Bandwidth 4.8 TB/s 9.6 TB/s
Interconnect    
NVIDIA NVLink 900 GB/s 900 GB/s
PCIe Gen5 128 GB/s 128 GB/s
MIG Support Up to 7 MIGs Up to 7 MIGs
Thermal Design Power (TDP) Up to 700W (configurable) Up to 700W (configurable)
Decoders 7 NVDEC, 7 JPEG 7 NVDEC, 7 JPEG

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